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Zairyo-to-Kankyo Vol. 72 (2023), No. 10

ISIJ International
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ONLINE ISSN: 1881-9664
PRINT ISSN: 0917-0480
Publisher: Japan Society of Corrosion Engineering

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Zairyo-to-Kankyo Vol. 72 (2023), No. 10

Film Deposition Behavior of Phosphorus Copper Tubes during Stress Corrosion Cracking

Takahito Nakajima, Hiroshi Tanimura, Kazuhiro Fukami, Kuniaki Murase

pp. 259-268

Abstract

The deposition behavior of films, corrosion products, during SCC on a phosphorus copper tube in an ammonia solution was investigated. It was found that Cu(OH)2 deposited on the tube surface and Cu2O deposited in the intergranular corrosion pit. The electrochemical behavior of the copper tube during SCC test indicated that pH in the intergranular corrosion pit is lower than that near the surface due to dissolution of phosphorus. Considering these environments, the difference of the deposited film type was explained by thermodynamics. It was also presumed that the Cu2O deposited thickly at the tip of the corrosion pit became the source of stress, leading to the occurrence of cracking.

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Film Deposition Behavior of Phosphorus Copper Tubes during Stress Corrosion Cracking

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