The Slight Degree of Corrosion of Stainless Steel for Semiconductor Manufacturing Plants
Haruo Tomari
pp. 202-209
Abstract
This review describes current trend in research and development of a slight degree of corrosion of stainless steel for semiconductor processing. Although organic materials such as polyvinyl chloride have been used for ultra-pure water piping in semiconductor processing, it has been pointed out that there are several problems of impurities release from the piping surface, insufficiency of heatproofing in heat-sterilizing etc. It has been reported that the amount of metal dissolution from electro-polished stainless steel in ultra-pure water was very small, and that controlled oxidation treatment after electropolishing gave more excellent corrosion resistance. On the other hand, the electropolished stainless steel pipe are used mainly for gas piping in semiconductor processing. However, it is reported that it is subject to a slight degree of corrosion in corrosive chlorine gas and other halogen gases. Moreover, it is proved that the corrosion resistance in halogen gases is improved by controlling the heat treatment condition of oxygen partial pressure and other factors, and the pre-heating suface polishing methods.