Investigation of Corrosion Resisted Electroplating Films for Electronic Component's Materials
Akira Chinda
pp. 66-75
抄録
It was introduced the 2 reseach results of electroplating films which have high corrosion resistance for electronic component's materials.
To prevent the corrosion of palladium-plated ferro-alloy bases for leadframes, the effect of pulse plating on nickel deposits used as the underlayer for palladium-plated layers was investigated. The nickel underlayers deposited using pulse current at a duty cycle of 9% improved the corrosion resistance of the palladium-plated ferro-alloy beses.
The deposition conditions and corrosion resistance of amorphous Ni-Mo-W ternary alloy films from a citric acid bath were investigated. The crystal structure of the films was influenced by the pH of the bath, and their corrosion resistance was excellent.