Measures for Mechanical Problems with Solid State Bonding of Ceramics and Metals
You Chul Kim, Tetsuya Yamamoto, Min Gang Yuan
pp. 314-319
DOI:
10.2207/qjjws.8.314Abstract
In this study, to consider a method for the prevention of the cracks occuring in ceramics on the solid state diffusion bonding of ceramics and metals, the modeling is done and the thermal elasto-plastic analysis is carried out. From the results, the characteristics of residual deformation and stress produced by the solid state diffusion bonding and its production mechanism are elucidated. It is also found that the main mechanical factor of the cracks occuring in ceramics is bending moment acting upon the ceramics which is caused by the difference of shrinkage between ceramics and metals. Therefore, it is considered that the bending moment acting upon the ceramic should be as small as possible for prevention of the cracks occuring in ceramics. From this point of view, the validity of small bending moment acting upon the ceramic is concretely shown. Moreover, the mechanical significance of the test specimen for the evaluation of bonding strength of ceramics and metals is elucidated.
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QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY Vol.8(1990), No.3