Interface behavior leading to Al/Cu dissimilar metal bonding formation with high-speed eutectic reaction induced by applying current
Makoto TATEMURA, Takahito WATANABE, Hisatoshi ASAI, Hiroshi KAWAKAMI
pp. 41-54
DOI:
10.2207/qjjws.43.41Backnumber
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Makoto TATEMURA, Takahito WATANABE, Hisatoshi ASAI, Hiroshi KAWAKAMI
pp. 41-54
DOI:
10.2207/qjjws.43.4118 Jan. (Last 30 Days)
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