Joining of A1050/A5052 and A1050/Cu by Ultrasonic Bonding and their Materials Evaluation
ABDEL-ALEEM Hamed, Toshio YAMAGATA, Mitsuaki KATOH, Kazumasa NISHIO, Tomiko YAMAGUCHI
We tried to bond A1050/A5052 and A1050/Cu by ultrasonic spot bonding and evaluated the bondability of joints by performing tensile shear test, the observation of microstructures and ultrasonic testing. In principle a good joint was obtained by ultrasonic bonding when we selected good bonding conditions and no intermetallic compound was observed at bond interface. It was observed that a crack initiated just before the maximum load near the boundary of the bond area of A1050 in both cases of A1050/A5052 and A1050/Cu by radiographic testing during shear test. Then bond area started to deform and changed its shape from circle to ellipse and the crack propagated further. The maximum load in shear test was obtained at the appropriate input energy depending on the cases of A1050/A5052 and A1050/Cu. The situation of bonds could be evaluated by ultrasonic testing. We could observe nano-crystals near the bond interface of A1050/Cu with TEM probably due to the rapid deformation during the bonding.