Effect of pressure and temperature on self-induced fusion solidification bonding of Aluminum by pressure controlled periodic motion
Hiroshi KAWAKAMI, Seiya KODAMA
Isothermal fusion and solidification of bonding interfaces occur by the self-induced fusion solidification bonding. Reaction diffusion between base metal and insert metal obtains the phase transformation at the bonding interface. Aluminum oxide film between aluminum base metal and copper insert metal obstacles the reaction diffusion. The collision between the oxide film and the metals produces the fracture of the oxide film and the reaction diffusion of each metal. Higher bonding pressure increases the joint strength and the bonding area. The deformation of the bonding interface under the static loading condition and the compression depth of the periodic motion under the dynamic loading condition are increased also with the increase of the bonding pressure. Both of compression deformation and depth promote fracture of aluminum oxide film. Increase of bonding pressure decrease bonding temperature to improve the deformation resistance of aluminum base metal. Bonding temperature affects also the joint strength and the bonding area by the change of the coefficients of reaction diffusion. Suitable bonding pressure and temperature condition obtains high joint strength and bonding area.