Long-term Reliability of Nickel Micro-Plating Bonding by Using Resonant Type Fatigue Testing Machine
YU Xinguang, Ryota DOMEN, Isamu MORISAKO, Keiko KOSHIBA, Tomonori IIZUKA, Kohei TATSUMI
Recently, SiC (silicon carbide) has attracted attention as a new material to replace silicon power semiconductors. Since SiC is a wide-bandgap semiconductor and has high heat resistance, it can be operated in a high temperature environment. However, the conventional power module package is mainly joined by a low melting point material such as lead-free solder, and interconnection does not have enough heat resistance. Therefore, we have been proposing and experimenting with Nickel Micro-Plating Bonding (NMPB) using Ni (nickel), which has excellent heat resistance and strong bonding strength, as a new bonding method. Although various researches have been conducted on the bonding reliability of NMPB, long-term reliability evaluated from the aspect of metal fatigue has not been much discussed. In this study, a test has been conducted using a resonant type fatigue testing machine and examined whether acceleration of fatigue evaluation time and long-term reliability of NMPB were confirmed.
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